Part Number Hot Search : 
25FU406B HM2101B MO66PN RF28611 T138A 24SH3 AD7545 16NS25
Product Description
Full Text Search
 

To Download APT13F120B Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  absolute maximum ratings thermal and mechanical characteristics g d s single die fredfet unit a v mj a unit w c/w c oz g inlbf nm ratings 14 9 50 30 1070 7 min typ max 625 0.20 0.11 -55 150 300 0.22 6.2 10 1.1 parameter continuous drain current @ t c = 25c continuous drain current @ t c = 100c pulsed drain current 1 gate-source voltage single pulse avalanche energy 2 avalanche current, repetitive or non-repetitive characteristic total power dissipation @ t c = 25c junction to case thermal resistance case to sink thermal resistance, flat, greased surface operating and storage junction temperature range soldering temperature for 10 seconds (1.6mm from case) package weight mounting torque ( to-247 package), 6-32 or m3 screw symbol i d i dm v gs e as i ar symbol p d r jc r cs t j ,t stg t l w t torque typical applications zvs phase shifted and other full bridge half bridge pfc and other boost converter buck converter single and two switch forward flyback features fast switching with low emi low t rr for high reliability ultra low c rss for improved noise immunity low gate charge avalanche energy rated rohs compliant to-247 d 3 pak APT13F120B apt13f120s 1200v, 14a, 1.2 max t rr , 250ns APT13F120B apt13f120s power mos 8 ? is a high speed, high voltage n-channel switch-mode power mosfet. this 'fredfet' version has a drain-source (body) diode that has been optimized for high reliability in zvs phase shifted bridge and other circuits through reduced t rr , soft recovery, and high recovery dv/dt capability. low gate charge, high gain, and a greatly reduced ratio of c rss /c iss result in excellent noise immunity and low switching loss. the intrinsic gate resistance and capacitance of the poly-silicon gate structure help control di/dt during switching, resulting in low emi and reliable paralleling, even when switching at very high frequency. n-channel fredfet microsemi website - http://www.microsemi.com 050-8131 rev d 8-2011 downloaded from: http:///
static characteristics t j = 25c unless otherwise speci ? ed source-drain diode characteristics dynamic characteristics t j = 25c unless otherwise speci ? ed APT13F120B_s 1 repetitive rating: pulse width and case temperature limited by maximum junction temperature. 2 starting at t j = 25c, l = 43.59mh, r g = 25 , i as = 7a. 3 pulse test: pulse width < 380 s, duty cycle < 2%. 4 c o(cr) is de ? ned as a ? xed capacitance with the same stored charge as c oss with v ds = 67% of v (br)dss . 5 c o(er) is de ? ned as a ? xed capacitance with the same stored energy as c oss with v ds = 67% of v (br)dss . to calculate c o(er) for any value of v ds less than v (br)dss, use this equation: c o(er) = -2.17e-7/v ds ^2 + 2.63e-8/v ds + 3.74e-11. 6 r g is external gate resistance, not including internal gate resistance or gate driver impedance. (mic4452) microsemi reserves the right to change, without notice, the speci ? cations and information contained herein. g d s unit v v/c v mv/c a na unit a v ns c a v/ns min typ max 1200 1.41 .91 1.2 2.5 4 5 -10 250 1000 100 min typ max 14 50 1.0 250 520 1.12 3.03 10 13.5 25 test conditions v gs = 0v , i d = 250 a reference to 25c, i d = 250 a v gs = 10v , i d = 7a v gs = v ds , i d = 1ma v ds = 1200v t j = 25c v gs = 0v t j = 125c v gs = 30v test conditions mosfet symbol showing the integral reverse p-n junction diode (body diode) i sd = 7a , t j = 25c, v gs = 0v t j = 25c t j = 125c i sd = 7a 3 t j = 25c di sd / dt = 100a/ s t j = 125c v dd = 100v t j = 25c t j = 125c i sd 7a, di/dt 1000a/ s, v dd = 800v, t j = 125c parameter drain-source breakdown voltage breakdown voltage temperature coef ? cient drain-source on resistance 3 gate-source threshold voltage threshold voltage temperature coef ? cient zero gate voltage drain current gate-source leakage current parametercontinuous source current (body diode) pulsed source current (body diode) 1 diode forward voltage reverse recovery time reverse recovery charge reverse recovery current peak recovery dv/dt symbol v br(dss) ? v br(dss) / ? t j r ds(on) v gs(th) ? v gs(th) / ? t j i dss i gss symbol i s i sm v sd t rr q rr i rrm dv/dt symbol parameter test conditions min typ max unit g fs forward transconductance v ds = 50v , i d = 7a 15 s c iss input capacitance v gs = 0v , v ds = 25v f = 1mhz 4765 pf c rss reverse transfer capacitance 55 c oss output capacitance 350 c o(cr) 4 effective output capacitance, charge related v gs = 0v , v ds = 0v to 800v 135 c o(er) 5 effective output capacitance, energy related 70 q g total gate charge v gs = 0 to 10v , i d = 7a, v ds = 600v 145 nc q gs gate-source charge 24 q gd gate-drain charge 70 t d(on) turn-on delay time resistive switching v dd = 800v , i d = 7a r g = 4.7 6 , v gg = 15v 26 ns t r current rise time 15 t d(off) turn-off delay time 85 t f current fall time 24 050-8131 rev d 8-2011 downloaded from: http:///
v gs = 6, 7, 8 & 9v 4.5v t j = 125c t j = 25c t j = -55c v gs = 10v 5v v ds > i d(on) x r ds(on) max. 250 sec. pulse test @ <0.5 % duty cycle normalized to v gs = 10v @ 7a t j = 125c t j = 25c t j = -55c c oss c iss i d = 7a v ds = 960v v ds = 240v v ds = 600v t j = 150c t j = 25c t j = 125c t j = 150c c rss t j = 125c t j = 25c t j = -55c v gs , gate-to-source voltage (v) g fs , transconductance r ds(on) , drain-to-source on resistance i d , drain current (a) i sd, reverse drain current (a) c, capacitance (pf) i d , drain current (a) i d , drian current (a) v ds(on) , drain-to-source voltage (v) v ds , drain-to-source voltage (v) figure 1, output characteristics figure 2, output characteristics t j , junction temperature (c) v gs , gate-to-source voltage (v) figure 3, r ds(on) vs junction temperature figure 4, transfer characteristics i d , drain current (a) v ds , drain-to-source voltage (v) figure 5, gain vs drain current figure 6, capacitance vs drain-to-source voltage q g , total gate charge (nc) v sd , source-to-drain voltage (v) figure 7, gate charge vs gate-to-source voltage figure 8, reverse drain current vs source-to-drain voltage 0 5 10 15 20 25 30 0 5 10 15 20 25 30 -55 -25 0 25 50 75 100 125 150 0 1 2 3 4 5 6 7 8 0 2 4 6 8 0 200 400 600 800 1000 1200 0 20 40 60 80 100 120 140 160 180 200 0 0.2 0.4 0.6 0.8 1.0 1.2 3530 25 20 15 10 50 3.02.5 2.0 1.5 1.0 0.5 0 1816 14 12 10 86 4 2 0 1614 12 10 86 4 2 0 1210 86 4 2 0 5040 30 20 10 0 6,0001,000 100 1050 45 40 35 30 25 20 15 10 50 APT13F120B_s 050-8131 rev d 8-2011 downloaded from: http:///
d 3 pak package outline to-247 (b) package outline 15.49 (.610)16.26 (.640) 5.38 (.212)6.20 (.244) 6.15 (.242) bsc 4.50 (.177) max. 19.81 (.780)20.32 (.800) 20.80 (.819)21.46 (.845) 1.65 (.065)2.13 (.084) 1.01 (.040)1.40 (.055) 3.50 (.138)3.81 (.150) 2.87 (.113)3.12 (.123) 4.69 (.185)5.31 (.209) 1.49 (.059) 2.49 (.098) 2.21 (.087)2.59 (.102) 0.40 (.016) drai n drai n source gate 5.45 (.215) bsc 2-plcs. 15.95 (.628)16.05(.632) 1.22 (.048)1.32 (.052) 5.45 (.215) bsc {2 plcs. } 4.98 (.196)5.08 (.200) 1.47 (.058) 1.57 (.062) 2.67 (.105)2.84 (.112) 0.46 (.018) {3 plcs} 0.56 (.022) heat sink (drain)and leads are plated 3.81 (.150)4.06 (.160) (base of lead) drai n (heat sink) 1.98 (.078)2.08 (.082) gate drai n source 0.020 (.001)0.178 (.007) 1.27 (.050)1.40 (.055) 11.51 (.453)11.61 (.457) 13.41 (.528)13.51(.532) revised8/29/97 1.04 (.041)1.15(.045) 13.79 (.543)13.99(.551) revised 4/18/95 1.016(.040) e1 sac: tin, silver, copper e3 100% sn plated dimensions in millimeters (inches) dimensions in millimeters (inches) 1ms 100ms r ds(on) 0.5 single pulse 0.1 0.3 0.7 0.05 d = 0.9 scaling for different case & junction temperatures: i d = i d(t c = 25 c) *( t j - t c )/125 peak t j = p dm x z jc + t c duty factor d = t 1 / t 2 t 2 t 1 p dm note: t 1 = pulse duration dc line 100 s i dm 10ms 13 s 100 s i dm 100ms 10ms 13 s r ds(on) dc line t j = 150c t c = 25c 1ms t j = 125c t c = 75c i d , drain current (a) v ds , drain-to-source voltage (v) v ds , drain-to-source voltage (v) figure 9, forward safe operating area figure 10, maximum forward safe operating area z jc , thermal impedance (c/w) 10 -5 10 -4 10 -3 10 -2 10 -1 1.0 rectangular pulse duration (seconds) figure 11. maximum effective transient thermal impedance junction-to-case vs pulse duration i d , drain current (a) 1 10 100 1200 1 10 100 1200 0.250.20 0.15 0.10 0.05 0 100 10 1 0.1 100 10 1 0.1 APT13F120B_s 050-8131 rev d 8-2011 downloaded from: http:///


▲Up To Search▲   

 
Price & Availability of APT13F120B

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X